Through decades, through-hole technology has been an integral part of printed circuit board (PCB) assembly. The benefits of surface-mount technology (SMT), like miniaturization, have made it more popular; however, there are many specific applications where through-hole technology remains vital. To keep up with the dynamic needs of the electronics industry, how is through-hole technology changing and evolving?
In this blog , we will discuss some key points about the future trends of through-hole technology in PCB assembly that PCB manufacturers and users should keep an eye on.
Future Trends in Through-Hole Technology
PCB manufacturing is rapidly evolving and so are the related technologies. Through-hole technology is also observing significant developments. Here are some key future trends in through-hole technology.
1) Miniaturization of Through-Hole Components
One challenge that PCB manufacturers in the USA and across the globe face is the never-ending quest for smaller and lighter gadgets. Manufacturers are coming up with fresh approaches. So, here are some ways:
Reduced Lead Pitch:
PCBs can now accommodate denser packing thanks to a reduction in the space between component leads.Compact Through-Hole Packages:
Component makers are always coming out with new, compact through-hole packages that provide the same functionality but take up less space.Thanks to these developments, through-hole technology components can be integrated into designs with limited space, allowing manufacturers to retain mechanical strength without compromising compact printed circuit board layouts.
2) High-Frequency Use Cases
Today, through-hole technology is not limited to providing strong mechanical connections. Due to developments in materials and manufacturing processes, through-hole components can now efficiently process signals at high frequencies. This opens up potential use cases such as:
Radio Frequency Circuits:
Through-hole technology is well-suited for radio frequency applications due to reduced signal distortion enabled by optimized lead lengths and improved lead designs.High-Speed Data Transmission:
To maintain signal integrity in high-speed data transmission lines, innovative plating techniques and specialized dielectric materials are used.These enhancements make through-hole technology a more flexible option for a broader range of printed circuit board applications.
3) Collaboration of Through-Hole Technology and SMT
Despite their long-standing differences, through-hole technology and surface-mount technology have started working together effectively.
Hybrid Printed Circuit Boards:
A practical approach where through-hole components provide mechanical strength and critical connections, while SMT components support miniaturization and high-density layouts.Focus on Different Functions:
Surface-mount technology excels in automated assembly and compact designs, whereas through-hole technology is preferred for high-power signals and robust electrical connections. Effective PCB assembly often involves using both technologies where they perform best.Assembly Advancements: Streamlining Through-Hole Assembly
Efficient and precise through-hole assembly continues to evolve alongside advancements in PCB assembly processes.
Improved Soldering Techniques:
Recent developments in selective soldering and laser soldering provide improved control and precision, resulting in better quality and reduced processing time.Automated Inspection Systems:
Advanced automated optical inspection (AOI) systems help ensure consistent quality and reduce the risk of human error during through-hole assembly.
PCB manufacturers and users in the USA and globally benefit from these advancements through faster production cycles and improved consistency.
Explore Through-Hole PCB Assembly with PCB Power
If you would like to learn more about through-hole technology, or have questions related to PCB manufacturing and PCB assembly, our team is here to help.
👉 Contact Us to discuss your PCB assembly requirements
👉 Explore our PCB assembly capabilities to see how we support through-hole and mixed-technology builds
FAQs
Q1. What is through-hole technology in printed circuit boards?
Through-hole technology involves inserting component leads through holes in a PCB and soldering them in place to create strong mechanical and electrical connections.
Q2. When is through-hole technology preferred in PCB assembly?
Through-hole technology is preferred in applications requiring mechanical durability, high-current handling, or secure connector mounting.
Q3. Is through-hole technology still used in modern PCB manufacturing?
Yes. Through-hole technology remains widely used in industrial, power, and mixed-technology printed circuit boards.
Q4. Can through-hole technology and SMT be used together on the same PCB?
Yes. Many modern printed circuit boards combine through-hole technology and surface-mount technology to balance strength and density.
Q5. Does PCB Power support through-hole PCB assembly?
Yes. PCB Power supports through-hole, SMT, and mixed-technology PCB assembly services.
